3D-Micromac
microDICE
0.05kW Solid
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0.05kW Solid cutting Machine
0.05 kW
300×300mm
Germany
±0.001mm
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Compared against 34 machines in this category
Laser dicing system for semiconductor wafer processing, stealth dicing and ablation modes, for silicon, SiC, GaN, glass wafers.
Power vs. work area compared to 14 machines in this category
| Brand | 3D-Micromac |
| Model | microDICE |
| Laser Type | Solid |
| Power Output | 0.05 kW |
| Wavelength | 355 nm |
| Work Area (L × W) | 300 × 300 mm |
| Positioning Accuracy | ±0.001 mm |
| Weight | 2000 kg |
| Power Consumption | 5 kW |
| Country of Origin | DE |
| Price Range | $300,000 - $600,000 |
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300×300mm
Common questions about the 3D-Micromac microDICE
The 3D-Micromac microDICE features a 0.05kW solid laser, suitable for metal cutting and sheet processing.
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